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Silicon ingot resin diamond grinding wheel

Silicon ingot resin diamond grinding wheel uses resin bond, high quality diamond abrasive, used for chamfering polycrystalline silicon block grinding surface. Common specifications 260 * 38 * 60 granularity 100-200 #, 250 * 38 * 60 600-1000 # suitable for Japanese BBS and other monocrystalline silicon polysilicon integrated machine.


Bold Group

Forturetools

BYD Abrasives

Malaysia
ADD: No.10 Dongqing Street,
High&New tech Development Zone.
Zhengzhou, Henan, China.
Postal code: 450001 E-mail：liu@news.hermons.cn
Phone: 0371-67662016 86162612
?Copyright 2004 Zhengzhou Bold Abrasives Co., Ltd. All Rights Reserved.
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